Products
Pastes of silver powder in organic solvent/binder for bonding chips without pressure and at temperature less than 250oC.
Dry films of silver powder for bonding chips under < 10 MPa pressure and at < 260oC.
Technology
The innovation of NBE's nanoTach® technology comes from proprietary formulations and procedures for making uniform pastes or dry films of silver powders. In recent years, die-attach based on silver sintering has emerged as a promising lead-free die-attach solution to replace soldering or epoxy curing.
Applications
NBE's nanoTach® pastes or dry films are targeted at joining semiconductor chips for high-performance, high-reliability, and high junction-temperature applications, such as power electronics, automotive electronics, concentrated photovoltaics, high-power laser diodes, and high-power, compact communication systems.