NBE’s nanoTach® pastes are targeted at joining semiconductor chips for high-performance, high-reliability, and high junction-temperature applications, such as power electronics, automotive electronics, concentrated photovoltaics, high-power light-emitting diodes (LEDs) or high-power laser diodes, and high-power, compact communication systems.
Recommended Heating Profiles
* Requirement on surface metallization: both the substrate and chip surfaces need be either silver or gold for strong bonding strength.
For paste stored in a jar, use a metal rod (e.g. a paper clip) to mix well; if the paste comes in syringes, use a simple vortex mixer (costing ~ $200) to hmogenize the content before use.
Dispense or stencil-print the paste onto a substrate.
Place chip on the "wet" silver paste; note: too much pressure should be avoided to prevent making the Ag layer too thin. A good bond-line thickness before heating is between 35 to 50 microns.
Heat the substrate in open air to 260oC at a ramp rate of 5oC to 7oC/min and soak for 10 to 30 minutes.
Cool down to 25oC.
A recommended heating profile for nanoTach-X: